One click fully automatic batch detection, can be directly used with assembly lines
A wafer contact angle detection device specially designed for wafer wafer customers, which can meet the multi-point testing of 6-12 inch wafer samples.
Used for large-sized, non cutting samples, with a maximum measurable sample size of 21 inches
The rack type high-temperature contact angle measuring instrument can measure the contact angle and surface tension of solution metals under high-temperature vacuum.
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