Suitable for surface cleaning and activation of various large-area and complex shaped materials, paired with a rotating gun head

Introduction: Paired with an efficient ultra-low temperature gun head, the processing temperature is below 50 degrees, and the plasma treatment effect is more obvious

Equipped with imported brand ARM chips and equipped with intelligent plasma power judgment function

Equipped with analog communication interface, optional with imported industrial grade 485 isolation chip

Paired with an efficient ultra-low temperature jet direct spray gun head, the processing temperature can be lower than 40 ℃, and the plasma treatment effect is more obvious

Using imported brand PFC chips and ARM chips, it can reduce reactive power by more than 25% and achieve power self matching, with low failure rate

Supports both digital and analog communication interfaces, and can interface with MES systems

Specially designed for surface modification of materials with large areas and complex shapes, it is an ideal choice for achieving cleaning, modification, and etching effects

Introduction: Ultra low processing temperature of 45 ℃, without causing thermal impact, ensuring stable processing effect

Military grade welding process, strong sealing of vacuum chamber, high-density plasma source, uniform cleaning in all directions

Customizable assembly line automation solution, low gas consumption, strong stability, reducing labor and usage costs

For semiconductor chip bonding pre-treatment, plastic sealing pre-treatment, photoresist removal, metal bonding and pre-treatment.